3.7*3.7*0.35 Soldering condition 浸焊条件

Preheat temperature

预热温度
110ºC max (Embilomental temperature of soldering surface of P. W. E)

110ºC 以下(印刷基板焊锡面周围的温度)

Preheat time

预热时间
60 sec, max

60 秒以内

Area of flux

助焊剂的面积
1/2 max of P. W. B. thickness

印刷基板厚度的1/2 以内

Temperature of solder

焊锡温度
255ºC max

255ºC 以下

Time of immersion

浸焊时间
Within 5 sec

5 秒以内

Soldering number

浸焊次数
Within 2 times (But should bring down heat of the first soldering)

2 次以内 (但应把第一次焊锡的温度降下来)

Printed wiring board

印刷基板

Single sided copper-clad laminates

单面铜箔